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FDP75N08 Datasheet(PDF) 1 Page - Fairchild Semiconductor |
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FDP75N08 Datasheet(HTML) 1 Page - Fairchild Semiconductor |
1 / 8 page ©2006 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FDP75N08 Rev. A June 2006 UniFET TM FDP75N08 75V N-Channel MOSFET Features • 75A, 75V, RDS(on) = 0.011Ω @VGS = 10 V • Low gate charge ( typical 150 nC) • Low Crss ( typical 85 pF) •Fast switching • 100% avalanche tested • Improved dv/dt capability Description These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies, active power factor correction, electronic lamp ballast based on half bridge topology. Absolute Maximum Ratings Thermal Characteristics TO-220 FDP Series G S D D G S Symbol Parameter FDP75N08 Units VDSS Drain-Source Voltage 75 V ID Drain Current - Continuous (TC = 25°C) 75 A - Continuous (TC = 100°C) 47.7 A IDM Drain Current - Pulsed (Note 1) 300 A VGSS Gate-Source Voltage ± 20 V EAS Single Pulsed Avalanche Energy (Note 2) 1164 mJ IAR Avalanche Current (Note 1) 75 A EAR Repetitive Avalanche Energy (Note 1) 13.1 mJ dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns PD Power Dissipation (TC = 25°C) 131 W - Derate above 25°C 1 W/°C TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C TL Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds 300 °C Symbol Parameter FDP75N08 Units RθJC Thermal Resistance, Junction-to-Case 0.95 °C/W RθCS Thermal Resistance, Case-to-Sink 0.5 °C/W RθJA Thermal Resistance, Junction-to-Ambient 62.5 °C/W |
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