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FMS6203MTC1400 Datasheet(PDF) 7 Page - Fairchild Semiconductor |
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FMS6203MTC1400 Datasheet(HTML) 7 Page - Fairchild Semiconductor |
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7 / 9 page  © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FMS6203 Rev. 1.0.2 7 Layout Considerations General layout and supply bypassing play a major role in high-frequency performance and thermal characteristics. Fairchild offers a demonstration board to guide layout and aid device evaluation. The demo board is a four- layer board with full power and ground planes. Following this layout configuration provides optimum performance and thermal characteristics for the device. For the best results, follow the steps and recommended routing rules listed below. Recommended Routing/Layout Rules Do not run analog and digital signals in parallel. Use separate analog and digital power planes to supply power. Traces should run on top of the ground plane at all- times. No trace should run over ground/power splits. Avoid routing at 90-degree angles. Minimize clock and video data trace length differ- ences. Include 10µF and 0.1µF ceramic power supply bypass capacitors. Place the 0.1µF capacitor within 0.1 inches of the device power pin. Place the 10µF capacitor within 0.75 inches of the device power pin. For multilayer boards, use a large ground plane to help dissipate heat. For two-layer boards, use a ground plane that extends beyond the device body by at least 0.5 inches on all sides. Include a metal paddle under the device on the top layer. Minimize all trace lengths to reduce series inductance. Thermal Considerations Since the interior of most systems, such as set-top- boxes, TVs, and DVD players are at +70ºC; consider- ation must be given to providing an adequate heat sink for the device package for maximum heat dissipation. When designing a system board, determine how much power each device dissipates. Ensure that devices of high power are not placed in the same location, such as directly above (top plane) and below bottom plane) each other on the PCB. PCB Thermal Layout Considerations Understand the system power requirements and envi- ronmental conditions. Maximize thermal performance of the PCB. Consider using 70µm of copper for high-power designs. Make the PCB as thin as possible by reducing FR4 thickness. Use vias in power pad to tie adjacent layers together. Remember that baseline temperature is a function of board area, not copper thickness. Modeling techniques can provide a first-order approxi- |
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