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ISL6526AIR Datasheet(PDF) 9 Page - Intersil Corporation |
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ISL6526AIR Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 15 page 9 FN9055.8 March 20, 2007 When the converter is sinking current, it is behaving as a boost converter that is regulating its input voltage. This means that the converter is boosting current into the input rail of the regulator. If there is nowhere for this current to go, such as to other distributed loads on the rail or through a voltage limiting protection device, the capacitance on this rail will absorb the current. This situation will allow the voltage level of the input rail to increase. If the voltage level of the rail is boosted to a level that exceeds the maximum voltage rating of any components attached to the input rail, then those components may experience an irreversible failure or experience stress that may shorten their lifespan. Ensuring that there is a path for the current to flow other than the capacitance on the rail will prevent this failure mode. Application Guidelines Layout Considerations Layout is very important in high frequency switching converter design. With power devices switching efficiently at 300kHz or 600kHz, the resulting current transitions from one device to another causing voltage spikes across the interconnecting impedances and parasitic circuit elements. These voltage spikes can degrade efficiency, radiate noise into the circuit, and lead to device overvoltage stress. Careful component layout and printed circuit board design minimizes the voltage spikes in the converters. As an example, consider the turn-off transition of the PWM MOSFET. Prior to turn-off, the MOSFET is carrying the full load current. During turn-off, current stops flowing in the MOSFET and is picked up by the lower MOSFET. Any parasitic inductance in the switched current path generates a large voltage spike during the switching interval. Careful component selection, tight layout of the critical components, and short, wide traces minimizes the magnitude of voltage spikes. There are two sets of critical components in a DC/DC converter using the ISL6526, ISL6526A. The switching components are the most critical because they switch large amounts of energy, and therefore tend to generate large amounts of noise. Next are the small signal components which connect to sensitive nodes or supply critical bypass current and signal coupling. A multi-layer printed circuit board is recommended. Figure 4 shows the connections of the critical components in the converter. Note that capacitors CIN and COUT could each represent numerous physical capacitors. Dedicate one solid layer, usually a middle layer of the PC board, for a ground plane and make all critical component ground connections with vias to this layer. Dedicate another solid layer as a power plane and break this plane into smaller islands of common voltage levels. Keep the metal runs from the PHASE terminals to the output inductor short. The power plane should support the input power and output power nodes. Use copper filled polygons on the top and bottom circuit layers for the phase nodes. Use the remaining printed circuit layers for small signal wiring. The wiring traces from the GATE pins to the MOSFET gates should be kept short and wide enough to easily handle the 1A of drive current. The switching components should be placed close to the ISL6526, ISL6526A first. Minimize the length of the connections between the input capacitors, CIN, and the power switches by placing them nearby. Position both the ceramic and bulk input capacitors as close to the upper MOSFET drain as possible. Position the output inductor and output capacitors between the upper MOSFET and lower MOSFET and the load. The critical small signal components include any bypass capacitors, feedback components, and compensation components. Position the bypass capacitor, CBP, close to the VCC pin with a via directly to the ground plane. Place the PWM converter compensation components close to the FB and COMP pins. The feedback resistors for both regulators should also be located as close as possible to the relevant FB pin with vias tied straight to the ground plane as required. VOUT ISLAND ON POWER PLANE LAYER ISLAND ON CIRCUIT PLANE LAYER LOUT COUT CIN +3.3V VIN KEY COMP ISL6526, ISL6526A UGATE R4 R2 CBP FB GND CPVOUT FIGURE 4. PRINTED CIRCUIT BOARD POWER PLANES AND ISLANDS R1 BOOT C2 VIA CONNECTION TO GROUND PLANE Q1 CBOOT PHASE D1 R3 C3 C1 Q2 LGATE PHASE VCC CVCC ISL6526, ISL6526A |
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