www.ti.com

VREF

(1) Pull-uprailcouldbeeitherVREForothersystemrail.

(2) SRSET/ACSET couldcomefromeitherDACorresistordividers.

Q2 (ACFET)

SI4435

Q3(BATFET)

SI4435

P

P

ACN

ACP

ACDRV

ACDET

ACGOOD

SRSET

ACSET

VREF

CELLS

CHGEN

VDAC

VADJ

GPIO

ADC

IADAPT

HOST

PVCC

BATDRV

HIDRV

PH

BTST

REGN

LODRV

PGND

SRP

SRN

P

PACK+

PACK-

SYSTEM

ADAPTER+

ADAPTER-

ACGOOD

AGND

bq24750

432kW

1%

1%

R1

R2

R5

10kW

C4

1 F

m

C5

100pF

Q4

FDS6680A

Q5

FDS6680A

L1

8.2 H

m

D1

BAT54

BAT

VREF

TS

PACK

THERMISTER

SENSE

1 %

R3

118kW

R4

DPMDET

R6

10kW

ACOP

Q1 (ACFET)

SI4435

C6

10 F

m

C3

0.010 W

C2

0.1 F

m

0.1 F

m

66.5kW

5.6kW

C7

10 F

m

C8

1 F

m

C9

0.1 F

m

C10

1 F

m

C15

0.1 F

m

C16

0.47 F

m

C14

0.1 F

m

C13

0.1 F

m

C11

10 F

m

R

0.010

SR

W

C12

10 F

m

C19

10 F

m

C1

10 F

m

C18

10 F

m

66.5kW

R10

R9

100kW

43kW

R8

R7

100kW

C17

10 F

m

PowerPad

R11100kW

PACKAGE THERMAL DATA

bq24750

SLUS735 – DECEMBER 2006

A.

Figure 2. Typical System Schematic, Voltage and Current Programmed by Resistor

ORDERING INFORMATION

Part number

Package

Ordering Number

Quantity

(Tape and Reel)

bq24750RHDR

3000

bq24750

28-PIN 5 x 5 mm QFN

bq24750RHDT

250

PACKAGE

θ

JA

39

°C/W

2.36 W

0.028 W/

°C

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

(2)

This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is

connected to the ground plane by a 2x3 via matrix.

3

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