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THS7318YZFT Datasheet(PDF) 2 Page - Texas Instruments |
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THS7318YZFT Datasheet(HTML) 2 Page - Texas Instruments |
2 / 20 page www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS (1) RECOMMENDED OPERATING CONDITIONS THS7318 SLOS517A – JANUARY 2007 – REVISED FEBRUARY 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. over operating free-air temperature range (unless otherwise noted)(1) VALUE UNIT VSS Supply voltage, VS+ to GND 5.5 V VI Input voltage –0.4 to VS+ V IO Output current ±100 mA Continuous power dissipation See Dissipation Rating Table Any condition (2) 150 °C TJ Maximum junction temperature Continuous operation, long term reliability(3) 125 °C Tstg Storage temperature range –65 to 150 °C HBM 2000 V ESD ratings CDM 1500 V MM 200 V (1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied Exposure to absolute maximum rated conditions for extended periods may degrade device reliability. (2) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process. (3) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device. POWER RATING(2) θ JC θ JA (TJ = 125°C) PACKAGE ( °C/W) ( °C/W) TA = 25°C TA = 70°C YZF 38 105 950 mW 428 mW (1) This data was taken with the JEDEC High-K test PCB. (2) Power rating is determined with a junction temperature of 125 °C. This is the point where distortion starts to substantially increase and long-term reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction temperature at or below 125 °C for best performance and reliability. over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VS+ Supply voltage 2.85 5 V TA Ambient temperature 0 70 °C 2 Submit Documentation Feedback |
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