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ISL6609 Datasheet(PDF) 4 Page - Intersil Corporation |
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ISL6609 Datasheet(HTML) 4 Page - Intersil Corporation |
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4 / 11 page  4 FN9221.1 March 6, 2006 Absolute Maximum Ratings Thermal Information Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input Voltage (VEN, VPWM) . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V BOOT Voltage (VBOOT-GND). . . -0.3V to 25V (DC) or 36V (<200ns) BOOT To PHASE Voltage (VBOOT-PHASE). . . . . . -0.3V to 7V (DC) -0.3V to 9V (<10ns) PHASE Voltage . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 15V (DC) GND -8V (<20ns Pulse Width, 10 µJ) to 30V (<100ns) UGATE Voltage . . . . . . . . . . . . . . . . VPHASE - 0.3V (DC) to VBOOT VPHASE - 5V (<20ns Pulse Width, 10µJ) to VBOOT LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V GND - 2.5V (<20ns Pulse Width, 5 µJ) to VCC + 0.3V Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-40°C to 125°C HBM ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2kV Recommended Operating Conditions Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-40°C to 100°C Maximum Operating Junction Temperature . . . . . . . . . . . . . . 125°C Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10% Thermal Resistance (Notes 1, 2, 3) θJA(°C/W) θJC(°C/W) SOIC Package (Note 1) . . . . . . . . . . . . 110 N/A QFN Package (Notes 2, 3). . . . . . . . . . 95 36 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C (SOIC - Lead Tips Only) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 2. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. 3. θJC, “case temperature” location is at the center of the package underside exposed pad. See Tech Brief TB379 for details. Electrical Specifications These specifications apply for TA = -40°C to 100°C, unless otherwise noted PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS VCC SUPPLY CURRENT Bias Supply Current IVCC PWM pin floating, VVCC = 5V - 132 - µA POR Rising -3.4 4.2 POR Falling 2.2 3.0 - Hysteresis - 400 - mV PWM INPUT Sinking Impedance RPWM_SNK 2.75 4 5.5 k Ω Source Impedance RPWM_SRC 3 4.25 5.75 k Ω Three-State Rising Threshold VVCC = 5V (100mV Hysteresis) - 1.70 2.00 V Three-State Falling Threshold VVCC = 5V (100mV Hysteresis) 3.10 3.41 - V Three-State Shutdown Holdoff Time tTSSHD tPDLU or tPDLL + Gate Falling Time - 20 - ns EN INPUT EN LOW Threshold 1.0 1.3 - V EN HIGH Threshold -1.6 2.0 V SWITCHING TIME (See Figure 1 on Page 6) UGATE Rise Time (Note 4) tRU VVCC = 5V, 3nF Load - 8.0 - ns LGATE Rise Time (Note 4) tRL VVCC = 5V, 3nF Load - 8.0 - ns UGATE Fall Time (Note 4) tFU VVCC = 5V, 3nF Load - 8.0 - ns LGATE Fall Time (Note 4) tFL VVCC = 5V, 3nF Load - 4.0 - ns UGATE Turn-Off Propagation Delay tPDLU VVCC = 5V, Outputs Unloaded - 18 - ns LGATE Turn-Off Propagation Delay tPDLL VVCC = 5V, Outputs Unloaded - 25 - ns ISL6609, ISL6609A |
Similar Part No. - ISL6609_06 |
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Similar Description - ISL6609_06 |
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