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TPS40077PWPRG4 Datasheet(PDF) 3 Page - Texas Instruments |
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TPS40077PWPRG4 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 43 page www.ti.com PACKAGE DISSIPATION RATINGS TPS40077 SLUS714 – JANUARY 2007 Thermal Impedance, TA = 25°C Power Rating TA = 85°C Power Rating Junction-to-Ambient(1) Natural convection 37 °C/W 2.7 W 1.08 W 150 LFM airflow 30 °C/W 3.33 W 1.33 W 250 LFM airflow 28 °C/W 3.57 W 1.42 W 500 LFM airflow 26 °C/W 3.84 W 1.52 W (1) For more information on the board and the methods used to determine ratings, see the PowerPAD Thermally Enhanced Package application report (SLMA002). 3 Submit Documentation Feedback |
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