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ABSOLUTE MAXIMUM RATINGS

(1)

DISSIPATION RATINGS

(1)

RECOMMENDED OPERATING CONDITIONS

ELECTROSTATIC DISCHARGE (ESD) PROTECTION

UCC28019

SLUS755 – APRIL 2007

ORDERING INFORMATION

OPERATING TEMPERATURE

PART NUMBER

UCC28019D

SOIC 8-Pin (D) ead (Pb)-Free/Green

–40

°C to 125°C

Plastic DIP 8 Pin (P) Lead

UCC28019P

(Pb)-Free/Green

(1)

SOIC (D) package is available taped and reeled by adding "R" suffix the the above part number, reeled quantities are 2500 devices per

reel.

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

VCC

–0.3 to 22

GATE

–0.3 to 16

Input voltage range

V

VINS, VSENSE, VCOMP, ICOMP

–0.3 to 7

ISENSE

–24 to 7

Input current range

VSENSE, ISENSE

–1 to 1

mA

Operating

–55 to 150

Storage

–65 to 150

°C

Soldering, 10s

300°

(1)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other condition beyond those included under “Recommended Operating

Conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods of time may affect device reliability.

PACKAGE

THERMAL IMPEDANCE

JUNCTION TO AMBIENT

(

°C/W)

SOIC-8 (D)

160

0.65

0.25

PDIP-8 (P)

110

1

0.36

(1)

Tested per JEDEC EIA/JESD 51-1. Thermal resistance is a strong function of board construction and layout. Air flow reduces thermal

resistance. This number is only a general guide. See TI document SPRA953 Thermal Metrics.

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

MAX

UNIT

VCC input voltage from a low-impedance source

21

V

Operating junction temperature

–40

125

°C

over operating free-air temperature range (unless otherwise noted)

PARAMETER

RATING

UNIT

Human Body Model (HBM)

2

kV

Charged Device Model (CDM)

500

V

2

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