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XTR111 Datasheet(PDF) 2 Page - Burr-Brown (TI) |
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XTR111 Datasheet(HTML) 2 Page - Burr-Brown (TI) |
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2 / 27 page  XTR111 SBOS375 − NOVEMBER 2006 www.ti.com 2 ABSOLUTE MAXIMUM RATINGS(1)(2) Power Supply Voltage, VVSP +44V . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage at SET(3) −0.5V to +14V . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage at IS(3, 5) (VVSP) − 5.5V to (VVSP) + 0.5V . . . . . . . . . . . . . . Voltage at REGS, REGF, VIN, OD, EF −0.5V to (VVSP) + 0.5V . . Voltage at REGF, VG −0.5V to (VVSP) + 0.5V . . . . . . . . . . . . . . . . . Current into any pin(3, 4) ±25mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output Short-Circuit Duration(5): VG Continuous to common and VVSP . . . . . . . . . . . . . . . . . . . . . REGF Continuous to common and VVSP . . . . . . . . . . . . . . . . . . . Operating Temperature Range −55 °C to +125°C . . . . . . . . . . . . . . . Storage Temperature Range −65 °C to +150°C . . . . . . . . . . . . . . . . . Electrostatic Discharge Rating (HBM) 2000V . . . . . . . . . . . . . . . . . (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) Refer to the Package Option Addendum at the end of this document for lead temperature ratings. (3) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails must be current limited. (4) The IS pin can source up to the output current-limit under normal operating conditions. (5) See text in Application Section regarding safe voltage ranges and currents. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING XTR111 DFN-10 DRC BSV (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. PIN DESCRIPTIONS PIN NAME FUNCTION 1 VSP Positive Supply 2 IS Source Connection 3 VG Gate Drive 4 REGS Regulator Sense 5 REGF Regulator Force 6 VIN Input Voltage 7 SET Transconductance Set 8 EF Error Flag (Active Low) 9 OD Output Disable (Active High) 10 GND Negative Supply Pad Pad Exposed Thermal Pad must be connected to GND PIN CONFIGURATIONS TOP VIEW DFN VSP IS VG REGS REGF GND OD EF SET VIN 1 2 3 4 5 10 9 8 7 6 DFN−10 Pad Exposed Thermal Die Pad on Underside. (Must be connected to GND) |
Similar Part No. - XTR111_07 |
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Similar Description - XTR111_07 |
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