ZXM61P03F

SEMICO NDUC TORS

ISSUE 1 - OCTOBER 2005

2

THERMAL RESISTANCE

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient (a)

200

°C/W

Junction to Ambient (b)

155

°C/W

NOTES:

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions

(b) For a device surface mounted on FR4 PCB measured at t 5 secs.

(c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph.

ABSOLUTE MAXIMUM RATINGS

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

-30

V

Gate- Source Voltage

20

V

Continuous Drain Current

-1.1

-0.9

A

Pulsed Drain Current (c)

-4.3

A

Continuous Source Current (Body Diode)(b)

-0.88

A

Pulsed Source Current (Body Diode)(c)

-4.3

A

Linear Derating Factor

625

5

mW

mW/°C

Linear Derating Factor

806

6.4

mW

mW/°C

Operating and Storage Temperature Range

-55 to +150

°C