www.ti.com

GENERAL INFORMATION

Terminal Assignment

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

20

19

GVDD_B

OTW

SD

PWM_A

RESET_AB

PWM_B

OC_ADJ

GND

AGND

VREG

M3

M2

M1

PWM_C

RESET_CD

PWM_D

VDD

GVDD_C

GVDD_A

BST_A

PVDD_A

OUT_A

GND_A

GND_B

OUT_B

PVDD_B

BST_B

BST_C

PVDD_C

OUT_C

GND_C

GND_D

OUT_D

PVDD_D

BST_D

GVDD_D

DKD PACKAGE

(TOP VIEW)

P0018-01

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

GVDD_B

OTW

NC

NC

SD

PWM_A

RESET_AB

PWM_B

OC_ADJ

GND

AGND

VREG

M3

M2

M1

PWM_C

RESET_CD

PWM_D

NC

NC

VDD

GVDD_C

DDV PACKAGE

(TOP VIEW)

GVDD_A

BST_A

NC

PVDD_A

PVDD_A

OUT_A

GND_A

GND_B

OUT_B

PVDD_B

BST_B

BST_C

PVDD_C

OUT_C

GND_C

GND_D

OUT_D

PVDD_D

PVDD_D

NC

BST_D

GVDD_D

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

P0016-02

TAS5162

SLES194C – OCTOBER 2006 – REVISED MAY 2007

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

The TAS5162 is available in two thermally enhanced packages:

• 36-pin PSOP3 package (DKD)

• 44-pin HTSSOP PowerPad™ package (DDV)

Both package types contain a heat slug that is located on the top side of the device for convenient thermal

coupling to the heatsink.

2

Submit Documentation Feedback