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MMA6280QT Datasheet(PDF) 7 Page - Freescale Semiconductor, Inc |
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MMA6280QT Datasheet(HTML) 7 Page - Freescale Semiconductor, Inc |
7 / 12 page Sensors 7 Freescale Semiconductor MMA6280QT MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self-align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. The flag underneath the package is internally connected to ground. It is not recommended for the flag to be soldered down. PCB DESIGN GUIDELINES The following are the recommended guidelines to follow for mounting QFN sensors for either automotive or consumer applications. 1. NSMD (Non Solder Mask Defined) is shown in Figure 7. 2. Solder mask opening = PCB land pad +0.1 mm. 3. Stencil aperture size = PCB land pad – 0.025mm, as shown in Figure 8 with a 6 mil stencil. 4. Do not place insertion components or vias at a distance less than 2mm from the package land area. 5. Signal trace connected to pads should be as symmetric as possible. Put dummy traces if there is NC pads, in order to have same length of exposed trace for all pads. Signal traces with 0.1mm width and min. 0.5mm length for all PCB land pad near package are recommended as shown in Figure 7 and Figure 8. Wider trace can be continued after the 0.5mm zone. 6. Use a standard pick and place process and equipment (no hand soldering process). 7. It is recommended to use a cleanable solder paste with an additional cleaning step after SMT mount 8. It is recommended to avoid screwing down the PCB to fix it into an enclosure since this may cause the PCB to bend. 9. PC boards should be rated for multiple reflow of lead- free conditions with 260°C maximum temperature. Figure 7. NSMD Solder Mask Design Guidelines • Do not solder down flag for consumer application • Do not place metal pattern or via structures underneath of package 0.55 mm 0.50 mm Package Pad PCB land pattern - NSMD Cu: 0.55 x 0.50 mm sq. Solder mask opening = PCB land pad +0.1mm =0.65x0.60 mm sq. Signal trace 0.1mm width and 0.5mm (min) length near package. Wider trace can be continued after these traces. |
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