MAC7112VFU50 datasheet(10/56 Pages) FREESCALE

Part #	MAC7112VFU50

Description	Microcontroller Family Hardware Specifications

Download	56 Pages

Scroll/Zoom	100%

Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

Direct Link	http://www.freescale.com

Logo

10 / 56 page

MAC7100 Microcontroller Family Hardware Specifications, Rev. 1.2

Preliminary

Electrical Characteristics

Freescale Semiconductor

10

3.6.1

Thermal Resistance Simulation Details

Comments:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature,

ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.

3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface

of the board at the center lead. For fused lead packages, the adjacent lead is used.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and junction temperature per JEDEC

JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Table 11. Thermal Resistance for Case Outline 983–02, 100 Lead 14x14 mm LQFP, 0.5 mm Pitch

Rating

Environment

Symbol

Value

Unit

Comments

Junction to Ambient (Natural Convection)

Single layer board (1s)

R

θJA

44

°C/W

1, 2

Junction to Ambient (Natural Convection)

Four layer board (2s2p)

R

θJMA

34

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Single layer board (1s)

R

θJMA

37

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Four layer board (2s2p)

R

θJMA

29

°C/W

1, 3

Junction to Board

R

θJB

18

°C/W

4

Junction to Case

R

θJC

7°C/W

5

Junction to Package Top

Natural Convection

ΨJT

2°C/W

6

Table 12. Thermal Resistance for Case Outline 987–01, 112 Lead 20x20 mm LQFP, 0.65 mm Pitch

Rating

Environment

Symbol

Value

Unit

Comments

Junction to Ambient (Natural Convection)

Single layer board (1s)

R

θJA

42

°C/W

1, 2

Junction to Ambient (Natural Convection)

Four layer board (2s2p)

R

θJMA

34

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Single layer board (1s)

R

θJMA

35

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Four layer board (2s2p)

R

θJMA

30

°C/W

1, 3

Junction to Board

R

θJB

22

°C/W

4

Junction to Case

R

θJC

7°C/W

5

Junction to Package Top

Natural Convection

ΨJT

2°C/W

6

Table 13. Thermal Resistance for Case Outline 918–03, 144 Lead 20x20 mm LQFP, 0.5 mm Pitch

Rating

Environment

Symbol

Value

Unit

Comments

Junction to Ambient (Natural Convection)

Single layer board (1s)

R

θJA

42

°C/W

1, 2

Junction to Ambient (Natural Convection)

Four layer board (2s2p)

R

θJMA

34

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Single layer board (1s)

R

θJMA

35

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Four layer board (2s2p)

R

θJMA

30

°C/W

1, 3

Junction to Board

R

θJB

22

°C/W

4

Junction to Case

R

θJC

7°C/W

5

Junction to Package Top

Natural Convection

ΨJT

2°C/W

6

Table 14. Thermal Resistance for Case Outline 1159A-01, 208 Lead 17x17 mm MAP BGA, 1.0 mm Pitch

Rating

Environment

Symbol

Value

Unit

Comments

Junction to Ambient (Natural Convection)

Single layer board (1s)

R

θJA

46

°C/W

1, 2

Junction to Ambient (Natural Convection)

Four layer board (2s2p)

R

θJMA

29

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Single layer board (1s)

R

θJMA

38

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Four layer board (2s2p)

R

θJMA

26

°C/W

1, 3

Junction to Board

R

θJB

19

°C/W

4

Junction to Case

R

θJC

7°C/W

5

Junction to Package Top

Natural Convection

ΨJT

2°C/W

6

Similar Part No. - MAC7112VFU50

Manufacturer	Part #	Datasheet	Description
Freescale Semiconductor...	MAC7112	112Kb / 710P	Microcontroller Family Reference Manual
Freescale Semiconductor...	MAC7112	112Kb / 16P	Microcontroller Family Reference Manual

More results

Similar Description - MAC7112VFU50

Manufacturer	Part #	Datasheet	Description
Motorola, Inc	MAC7100	1Mb / 48P	MAC7100 Microcontroller Family Hardware Specifications
	MPC860EC	857Kb / 76P	Family Hardware Specifications
	MPC860EC	857Kb / 76P	Family Hardware Specifications
Freescale Semiconductor...	MPC862	1Mb / 88P	PowerQUICC??Family Hardware Specifications
	MPC860	1Mb / 80P	PowerQUICC??Family Hardware Specifications
	MCF5213	869Kb / 56P	Microcontroller Family Hardware Specification
	MPC8270VVUPEA	624Kb / 83P	PowerQUICC II Family Hardware Specifications
	MPC8270ZQMIBA	624Kb / 83P	PowerQUICC II Family Hardware Specifications
	MPC8247VRTMFA	400Kb / 61P	PowerQUICC II Family Hardware Specifications
Motorola, Inc	MPC8260AEC	347Kb / 48P	MPC826xA (HiP4) Family Hardware Specifications

More results

MAC7112VFU50 Datasheet(PDF) 10 Page - Freescale Semiconductor, Inc

MAC7112VFU50 Datasheet(HTML) 10 Page - Freescale Semiconductor, Inc

Similar Part No. - MAC7112VFU50

Similar Description - MAC7112VFU50

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56

Datasheet Download

Link URL