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MA4SPS502 Datasheet(PDF) 2 Page - Tyco Electronics

Part # MA4SPS502
Description  SURMOUNT PIN Diode
Download  4 Pages
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Manufacturer  MACOM [Tyco Electronics]
Direct Link  http://www.macom.com
Logo MACOM - Tyco Electronics

MA4SPS502 Datasheet(HTML) 2 Page - Tyco Electronics

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SURMOUNTTM
PIN Diode
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
2
V1
MA4SPS502
Electrical Specifications @ + 25 °C
Symbol
Test Conditions
Units
Min.
Typ.
Max.
CT
-40 Volts, 1 MHz
pF
0.140
0.200
CT
-40 Volts, 1 GHz
pF
0.090
RS
100 mA, 100 MHz
1.4
2.2
RS
20 mA, 100 MHz
2.4
3.2
VF
10 mA
V
0.87
1.00
VR
10
µA
V
l -200 l
l -275 l
IR
-200 V
µA
l -10 l
IR
-40 V
nA
8
RθJL
Steady state
°C/W
50
TL
+10 mA / -6 mA measured at 90% voltage
µs
2.8
Handling Procedures
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum
pickups
is
strongly
recommended
for
individual components. Bulk handling should insure
that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through
the use of surface mount technology. Mounting pads
are conveniently located on the bottom surface of
these diodes and are removed from the active junc-
tion locations. These devices are well suited for
solder attachment onto hard and soft substrates.
The use of 80/20 Au/Sn and 60/40 Sn/Pb solder is
recommended, with an equal temperature profile
across the contacts. Conductive epoxy paste for
attachment may also be used.
When soldering these devices to a hard substrate,
hot gas die bonding is preferred. We recommend
utilizing a vacuum tip and a force of 60 to 100 grams
applied normal to the top surface of the device.
When
soldering
to
soft
substrates,
it
is
recommended to use a lead-tin interface at the
circuit board mounting pads. Position the die so that
its mounting pads are aligned with the circuit board’s
mounting pads and reflow the solder by heating the
Functional Schematic
1
circuit trace near the mounting pad while applying 60
to 100 grams of force perpendicular to the top
surface of the die.
Since the HMIC™ glass is transparent, the edges of
the mounting pads closest to each other can be
visually inspected through the die after attach is
completed.
Rp
Cp
Ls
Rvia
Rvia
+
-
1. Rs = 2 * Rvia + Rp


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