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MA4SPS502 Datasheet(PDF) 2 Page - Tyco Electronics |
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MA4SPS502 Datasheet(HTML) 2 Page - Tyco Electronics |
2 / 4 page SURMOUNTTM PIN Diode M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. 2 V1 MA4SPS502 Electrical Specifications @ + 25 °C Symbol Test Conditions Units Min. Typ. Max. CT -40 Volts, 1 MHz pF 0.140 0.200 CT -40 Volts, 1 GHz pF 0.090 RS 100 mA, 100 MHz Ω 1.4 2.2 RS 20 mA, 100 MHz Ω 2.4 3.2 VF 10 mA V 0.87 1.00 VR 10 µA V l -200 l l -275 l IR -200 V µA l -10 l IR -40 V nA 8 RθJL Steady state °C/W 50 TL +10 mA / -6 mA measured at 90% voltage µs 2.8 Handling Procedures All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Techniques Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these diodes and are removed from the active junc- tion locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20 Au/Sn and 60/40 Sn/Pb solder is recommended, with an equal temperature profile across the contacts. Conductive epoxy paste for attachment may also be used. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and a force of 60 to 100 grams applied normal to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board’s mounting pads and reflow the solder by heating the Functional Schematic 1 circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. Since the HMIC™ glass is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is completed. Rp Cp Ls Rvia Rvia + - 1. Rs = 2 * Rvia + Rp |
Similar Part No. - MA4SPS502_1 |
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Similar Description - MA4SPS502_1 |
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