SP6T PIN Diode Switch with Integrated Bias Network

MA4SW610B-1

V 1.00

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or information contained herein without notice.

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5

Eutectic Die Attachment

An 80/20 gold-tin eutectic solder preform is recommended

with a work surface temperature of 255

temperature of 265

temperature should be 290

to temperatures greater than 320

No more than three seconds should be required for the attachment.

Epoxy Die Attachment

Assembly should be preheated to 125-150

thickness of 2 mils is recommended for best electrical and

thermal conductivity.

A thin epoxy fillet should be visible

around the perimeter of the chip after placement. Cure epoxy

per manufacturer’s recommended schedule.

Assembly Considerations

The following precautions should be observed for successful

assembly of the die.

Cleanliness

These chips should be handled in a clean environment. Do not

attempt to clean die after installation.

Electro-Static Sensitivity

The MA4SW Series PIN switches are ESD, Class 1 sensitive.

The proper ESD handling procedures should be used.

Wire Bonding

Thermosonic wedge wire bonding using 0.003” x 0.00025”

ribbon or 0.001” diameter gold wire is recommended. A stage

temperature of 150

used. Ultrasonic energy should be adjusted to the minimum

required. RF bonds should be as short as possible to minimize

inductance.

Mounting

These chips have Ti-Pt-Au back metal. They can be die

mounted with a 80Au/20Sn or Sn62/Pb36/Ag2 solder preform

or electrically conductive Ag epoxy. Mounting surface must

be clean of oils and contaminants and flat

.