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MAAP-000076-PKG001 Datasheet(PDF) 1 Page - Tyco Electronics

Part # MAAP-000076-PKG001
Description  Amplifier, Power, 16W 1.3-2.5 GHz
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Manufacturer  MACOM [Tyco Electronics]
Direct Link  http://www.macom.com
Logo MACOM - Tyco Electronics

MAAP-000076-PKG001 Datasheet(HTML) 1 Page - Tyco Electronics

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Amplifier, Power, 16W
1.3-2.5 GHz
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.comfor additional data sheets and product information.
Rev —
Preliminary Datasheet
1
MAAP-000076-PED000
1.
TB = MMIC Base Temperature
2.
Adjust VGG between –2.6 and –1.5V to achieve specified Idq.
Parameter
Symbol
Typical
Units
Bandwidth
f
1.3-2.5
GHz
Output Power
POUT
42
dBm
1-dB Compression Point
P1dB
41
dBm
Small Signal Gain
G
25
dB
Input VSWR
VSWR
1.3:1
Gate Current
IGG
33
mA
Drain Current
IDD
5.2
A
Output VSWR
VSWR
1.6:1
2nd Harmonic
2f
25
dBc
Power Added Efficiency
PAE
29
%
Features
16 Watt Saturated Output Power Level
Eutectically Mounted to Heat Spreader
Next level integration is a Silver Epoxy-Based Process
Variable Drain Voltage (6-10V) Operation
MSAG™ Process
Description
The MAAPGM0076-PED000 is a 2-stage 16 W power amplifier with on-chip bias net-
works eutectically mounted on a 10-mil thick Copper Molybdenum (CuMo) pedestal.
This product is fully matched to 50 ohms on both the input and output. It can be used as
a power amplifier stage or as a driver stage in high power applications.
Fabricated using M/A-COM’s repeatable, high performance and highly reliable GaAs
Multifunction Self-Aligned Gate (MSAG™)Process, each device is 100% RF tested at
the die-on-pedestal assembly level to ensure performance compliance.
M/A-COM’s MSAG™ process features robust silicon-like manufacturing processes,
planar processing of ion implanted transistors, multiple implant capability enabling
power, low-noise, switch and digital FETs on a single chip, and polyimide scratch pro-
tection for ease of use with automated manufacturing processes. The use of refractory
metals and the absence of platinum in the gate metal formulation prevents hydrogen
poisoning when employed in hermetic packaging.
Electrical Characteristics: TB = 45°C
1, Z
0 = 50 Ω, VDD = 10V, IDQ = 3.8A
2, P
in = 24 dBm, RG = 30Ω
Primary Applications
Radio Communications
SatCom
Also Available in:
Description
Ceramic Package
Sample Board (Die)
Sample Board (Pkg)
Mechanical Sample (Die)
Part Number
MAAP-000076-PKG001
MAAP-000076-SMB004
MAAP-000076-SMB001
MAAP-000076-MCH000


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