Amplifier, Power, 18W

7.5-10.5 GHz

M/A-COM Inc. and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

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Visit www.macom.comfor additional data sheets and product information.

Rev —

Preliminary Datasheet

7

MAAP-000079-PED000

Pad

Size (

μm)

RF In and Out

100 x 200

200 x 150

150 x 150

Size (mils)

4 x 8

8 x 6

6 x 6

150 x 125

6 x 5

500 x 200

20 x 8

Pad No.

1

2

3

4

5

Bond Pad Dimensions

Mechanical Information

Chip edge to bond pad dimensions are shown to the center of the bond pad.

Figure 20. Die Layout