Amplifier, Power, 1 W

2-18 GHz

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no warranty, representation or guarantee regarding the suitability of its

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information.

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Visit www.macom.com for additional data sheets and product information.

Rev -

Preliminary Datasheet

7

MAAP-000080-DIE000

Figure 2. Recommended operational configuration. Wire bond as shown

.

Assembly Instructions:

Die attach:

Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C

to less than 5 minutes.

Wirebonding:

Bond @ 160 °C using standard ball or thermal compres-

sion wedge bond techniques. For DC pad connections, use either ball or

wedge bonds. For best RF performance, use wedge bonds of shortest

length, although ball bonds are also acceptable.

Assembly and Bonding Diagram

100 pF

RF

OUT

RF

IN

100 pF

0.1

μF

V

GG

0.1

μF

130

Ω

V

DD