Amplifier, Power, 0.6W

1.5-3.3 GHz

MAAPGM0026-DIE

M/A-COM Inc. and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

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Visit www.macom.com for additional data sheets and product information.

903185 —

Preliminary Information

5

Figure 6. Recommended bonding diagram for pedestal mount.

Support circuitry typical of MMIC characterization fixture for CW test-

Assembly Instructions:

Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.

Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.

For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge

bonds of shortest length, although ball bonds are also acceptable.

damage to amplifier.

100 pF

100 pF

RF

IN

RF

OUT

0.1

μF

V

GG

0.1

μF

V

DD

Assembly and Bonding Diagram