9.5-12.0 GHZ, 4W Power Amplifier

MAAPGM0062 –DIE

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no warranty, representation or guarantee regarding the suitability of its

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information.

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RO-P-DS-3095

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Preliminary Datasheet

4

Mechanical Information

Chip Size: 4.428 x 4.302 x 0.075 mm

(

174 x 169 x 3 mils)

Pad

Size (

µm)

RF In and Out

200 x 150

DC Drain Supply Voltage VDD

150 x 500

DC Gate Supply Voltage VGG

150 x 100

Size (mils)

8 x 6

6 x 20

6 x 4

Bond Pad Dimensions

Figure 7.

0.164mm.

0

0

2.152mm.

4.146mm.

4.302mm.

2.152mm.

0.161mm.

GND: G

GND: G

GND: G

GND: G

GND :G

GND :G

GND :G