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MAAPSS0111TR-3000 Datasheet(PDF) 3 Page - Tyco Electronics |
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MAAPSS0111TR-3000 Datasheet(HTML) 3 Page - Tyco Electronics |
3 / 6 page 1.25 W VSAT Power Amplifier 13.75—14.5 GHz MAAPSS0111 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. V2P 3 RoHS Compliant Notes on board design: 1. A low loss dielectric material such as Rogers 4003, er = 3.38, is recommended for this application. 2. A substrate thickness of 20 mils (0.508 mm) maximum is recommended to minimize thermal resistance and ground impedances. 3. RF transmission line impedance must be 50 ohms (w = 42 mils (1.0668 mm) for t = 20 mils (0.508 mm), Rogers 4003). 4. The board must provide low thermal resistance from package base to heat sink to accommodate the 3 W typical power dissipation. 5. Metal foil thickness in the vias is critical to thermal resistance. The recommended metalization is 1 oz (35 mm minimum thickness). 6. The application board is configured with 36 vias, each 12 mil (0.3048 mm) in diameter beneath the package base. Conductive via fill material is recommended to minimize thermal resistance and to prevent solder from wicking into vias. 7. The exposed package pad must be properly soldered to the board. 8. Case temperature is measured at the interface between the package bottom and circuit board. Evaluation Test Board Designator Value Foot Print C1, C10 1 uF 0402 C2, C9 10 pF 0402 C3, C8 10 uF 0804 C4, C7 0.1 uF 0402 C5, C6 100 pF 0402 External Parts List Cross Section View |
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