RF TEST CIRCUIT

NE85002 SERIES

BIASING PROCEDURE

Turn on the power supply.

Make sure its voltage is 0 V.

Turn on S1 and S2. Apply

the RF input and adjust the gate

voltage to maintain the desired

drain current. Do not exceed a

gate current of 10 mA

RF

POWER

SOURCE

GATE

BIAS

SUPPLY

20dB

DIRECTIONAL

COUPLER

BIAS

TEE

TUNER

D.U.T.

10 dB

ATTN.

TUNER

POWER

METER

POWER

METER

30 dB

ATTN.

BIAS

TEE

DRAIN

1 K

Ω

Circulator

NE8500200 (CHIP)

(Units in µm)

DIE ATTACHMENT

Die attach can be accomplished with either Au-Ge (390±10°C) or

Au-Sn (290 ± 10°C) preforms in a forming gas environment. Epoxy

die attach is not recommended.

BONDING

Gate and drain bonding wires should be minimum length, semi-

hard fold wire (3-8% elongation) 30 microns or less in diameter.

The source should be connected with gold ribbon or mesh.

Bonding should be performed with a wedge tip that has a taper of

approximately 15°. Die attach and bonding time should be kept to

a minimum. As a general rule, the bonding operation should be

kept within a 300°C - 10 minute curve. If longer periods are

required, the temperature should be lowered.

PRECAUTIONS

The user must operate in a clean, dry environment. The chip

channel is glassivated for mechanical protection only and does not

preclude the necessity of a clean environment.

The bonding equipment should be periodically checked for sources

of surge voltage and should be properly grounded at all times. All

test and handling equipment should be grounded to minimize the

possibilities of static discharge.

See AN-1001 Recommended Handling Procedure for Microwave

Transistor & MMIC Chips for additional infromation.

PACKAGE OUTLINE 95

(Units in mm)

OUTLINE DIMENSIONS AND HANDLING

110

100

100

100

100

240

1800

640

90

0.7

±0.1

4.0 MIN

φ2.5±0.3

5.9

±0.2

14.0

±0.15

18.0

±0.5

0.1

2.1

±0.15

0.2 MAX

7.2

±0.2

1.2

4.5 MAX

GATE

2 PLACES

SOURCE

6.5

±0.3

+.06

-.02

DRAIN

Life Support Applications

These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably

be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and

agree to fully indemnify CEL for all damages resulting from such improper use or sale.

EXCLUSIVE NORTH AMERICAN AGENT FOR NEC RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS

CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279

Internet: http://WWW.CEL.COM

06/26/2002

DATA SUBJECT TO CHANGE WITHOUT NOTICE