NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).

(3) Keep the track length of the ground terminals as short as possible.

(5) Exposed heatsink at bottom on package must be soldered to PCB RF/DC ground.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions.

For soldering

methods and conditions other than those recommended below, contact your nearby sales office.

Soldering Method

Soldering Conditions

Condition Symbol

Infrared Reflow

Peak temperature (package surface temperature)

: 260

°C or below

Time at peak temperature

: 10 seconds or less

Time at temperature of 220

°C or higher

: 60 seconds or less

Preheating time at 120 to 180

°C

: 120

±30 seconds

Maximum number of reflow processes

: 3 times

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

IR260

Wave Soldering

Peak temperature (molten solder temperature)

: 260

°C or below

Time at peak temperature

: 10 seconds or less

Preheating temperature (package surface temperature) : 120

°C or below

Maximum number of flow processes

: 1 time

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

WS260

Partial Heating

Peak temperature (terminal temperature)

: 350

°C or below

Soldering time (per side of device)

: 3 seconds or less

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

HS350

Caution Do not use different soldering methods together (except for partial heating).

Data Sheet PU10541EJ02V0DS

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