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MC33888FBR2 Datasheet(PDF) 8 Page - Freescale Semiconductor, Inc |
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MC33888FBR2 Datasheet(HTML) 8 Page - Freescale Semiconductor, Inc |
8 / 40 page Analog Integrated Circuit Device Data 8 Freescale Semiconductor 33888 ELECTRICAL CONNECTIONS MAXIMUM RATINGS ELECTRICAL CONNECTIONS MAXIMUM RATINGS Table 4. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS Power Supply Voltage Steady State VPWR -16 to 41 V Input Pin Voltage (1) VIN -0.3 to 7.0 V WAKE Input Pin Clamp Current IWICI 2.5 mA Continuous per Output Current (2) Low-Sides 4, 6, 8, 10 Low-Sides 5, 7, 9, 11 IOUTLS 500 800 mA Continuous per Output Current (3) High-Sides 0, 1 High-Sides 2, 3 IOUTHS 10 5.0 A Output Clamp Energy High-Sides 0, 1 (4) High-Sides 2, 3 (5) Low-Sides (6) EHS EHS ELS 450 120 50 mJ ESD Voltage (7) Human Body Model Machine Model VESD1 VESD2 ±2000 ±200 V Notes 1. Exceeding voltage limits on SCLK, SI, CS, WDIN, RST, IHS, FSI, or ILS pins may cause a malfunction or permanent damage to the device. 2. Continuous low-side output current rating so long as maximum junction temperature is not exceeded. Operation at 125°C ambient temperature will require calculation of maximum output current using package thermal resistance. 3. Continuous high-side output current rating so long as maximum junction temperature is not exceeded. Operation at 125°C ambient temperature will require calculation of maximum output current using package thermal resistance. 4. Active HS0 and HS1 clamp energy using the following conditions: single nonrepetitive pulse, VPWR = 16.0 V, L = 40 mH, TJ = 150°C. 5. Active HS2 and HS3 clamp energy using the following conditions: single nonrepetitive pulse, VPWR = 16.0 V, L = 10 mH, TJ = 150°C. 6. Active low-side clamp energy using the following conditions: single nonrepetitive pulse, 450 mA, TJ = 150°C. 7. ESD1 testing is performed in accordance with the Human Body Model (CZAP =100 pF, RZAP = 1500 Ω), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP= 0 Ω). |
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