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MMA3201EG Datasheet(PDF) 7 Page - Freescale Semiconductor, Inc |
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MMA3201EG Datasheet(HTML) 7 Page - Freescale Semiconductor, Inc |
7 / 10 page Sensors Freescale Semiconductor 7 MMA3201D MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self-align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. Figure 7. Footprint SOIC-20 (Case 475A-01) 0.380 in. 9.65 mm 0.050 in. 1.27 mm 0.024 in. 0.610 mm 0.080 in. 2.03 mm |
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