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MP3H6115AC6T1 Datasheet(PDF) 6 Page - Freescale Semiconductor, Inc |
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MP3H6115AC6T1 Datasheet(HTML) 6 Page - Freescale Semiconductor, Inc |
6 / 12 page Sensors 6 Freescale Semiconductor MP3H6115A MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. Figure 5. SSOP Footprint (Case 1317 and 1317A) 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm 0.387 9.83 0.150 3.81 0.050 1.27 TYP |
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