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MPC8247CVRI Datasheet(PDF) 11 Page - Freescale Semiconductor, Inc |
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MPC8247CVRI Datasheet(HTML) 11 Page - Freescale Semiconductor, Inc |
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11 / 60 page  MPC8272 PowerQUICC II™ Family Hardware Specifications, Rev. 1.5 Freescale Semiconductor 11 Thermal Characteristics 4 Thermal Characteristics Table 6 describes thermal characteristics. Refer to Table 2 for information on a given device’s package. Discussions of each characteristic are provided in sections 4.1 through 4.7. For the these discussions, PD =(VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers. 4.1 Estimation with Junction-to-Ambient Thermal Resistance An estimation of the chip junction temperature, TJ, in C can be obtained from the equation: TJ = TA + (RθJA × PD) where: TA = ambient temperature (ºC) RθJA = package junction-to-ambient thermal resistance (ºC/W) PD = power dissipation in package The junction-to-ambient thermal resistance is an industry standard value which provides a quick and easy estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible. 4 The leakage current is measured for nominal VDDH,VCCSYN, and VDD. 5 MPC8272 and MPC8271 only. Table 6. Thermal Characteristics Characteristic Symbol Value Unit Air Flow Junction-to-ambient— single-layer board 1 1 Assumes no thermal vias RθJA 27 °C/W Natural convection 21 1 m/s Junction-to-ambient— four-layer board RθJA 19 °C/W Natural convection 16 1 m/s Junction-to-board 2 2 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. RθJB 11 °C/W — Junction-to-case 3 3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). RθJC 8 °C/W — Junction-to-package top 4 4 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. RθJT 2 °C/W — |
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