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MPC8541PXAPF Datasheet(PDF) 11 Page - Freescale Semiconductor, Inc |
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MPC8541PXAPF Datasheet(HTML) 11 Page - Freescale Semiconductor, Inc |
11 / 84 page MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4 Freescale Semiconductor 11 Power Characteristics 2.1.4 Output Driver Characteristics Table 3 provides information on the characteristics of the output driver strengths. The values are preliminary estimates. 3 Power Characteristics The estimated typical power dissipation for this family of PowerQUICC III devices is shown in Table 4. Table 3. Output Drive Capability Driver Type Programmable Output Impedance ( Ω) Supply Voltage Notes Local bus interface utilities signals 25 OVDD = 3.3 V 1 42 (default) PCI signals 25 2 42 (default) DDR signal 20 GVDD = 2.5 V TSEC/10/100 signals 42 LVDD = 2.5/3.3 V DUART, system control, I2C, JTAG 42 OVDD = 3.3 V Notes: 1. The drive strength of the local bus interface is determined by the configuration of the appropriate bits in PORIMPSCR. 2. The drive strength of the PCI interface is determined by the setting of the PCI_GNT1 signal at reset. Table 4. Power Dissipation(1) (2) Notes: 1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD.. 2. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. Any customer design must take these considerations into account to ensure the maximum 105 degrees junction temperature is not exceeded on this device. CCB Frequency (MHz) Core Frequency (MHz) VDD Typical Power(3)(4) (W) Maximum Power(5) (W) 200 400 1.2 4.4 6.1 500 1.2 4.7 6.5 600 1.2 5.0 6.8 267 533 1.2 4.9 6.7 667 1.2 5.4 7.2 800 1.2 5.8 8.6 333 667 1.2 5.5 7.4 833 1.2 6.0 8.8 1000(6) 1.3 9.0 12.2 |
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