MPXC2011DT1

Rev 5, 10/2006

Freescale Semiconductor

Technical Data

© Freescale Semiconductor, Inc., 2006. All rights reserved.

High Volume Sensor for Low

Pressure Applications

Freescale Semiconductor has developed a low cost, high volume, miniature

pressure sensor package which is ideal as a sub-module component or a

disposable unit. The unique concept of the Chip Pak allows great flexibility in

system design while allowing an economic solution for the designer. This new

chip carrier package uses Freescale Semiconductor's unique sensor die with its

piezoresistive technology, along with the added feature of on-chip, thin-film

temperature compensation and calibration.

NOTE: Freescale Semiconductor is also offering the Chip Pak package in

application-specific configurations, which will have an “SPX” prefix,

followed by a four-digit number, unique to the specific customer

Features

•

Low Cost

•

Integrated Temperature Compensation and Calibration

•

Ratiometric to Supply Voltage

•

Polysulfone Case Material (Medical, Class V Approved)

•

Provided in Easy-to-Use Tape and Reel

Typical Applications

•

Respiratory Diagnostics

•

Air Movement Control

•

Controllers

•

Pressure Switching

NOTE: The die and wire bonds are exposed on the front side of the Chip Pak

(pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's

housing. Use caution when handling the devices during all processes.

Freescale Semiconductor's MPXC2011DT1/ MPXC2012DT1 Pressure Sensor has been designed for medical usage by

combining the performance of Freescale Semiconductor's shear stress pressure sensor design and the use of biomedically

approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used

with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The

portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating.

The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including:

tissue culture test, rabbit implant, hemolysis, intracutaneous test in rabbits, and system toxicity, USP.

The MPXC2011DT1 contains a silicone dielectric gel which covers the silicon piezoresistive sensing element. The gel is a

nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of

the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the

corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing,

as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure

transducers. A biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the performance

of the sensor.

The MPXC2012DT1 is a no-gel option.

ORDERING INFORMATION

Device Order No.

Case No.

Device Description

Device Marking

MPXC2011DT1

423A

Chip Pak, 1/3 Gel

Date Code, Lot ID

MPXC2012DT1

423A

Chip Pak, No Gel

Date Code, Lot ID

Packaging Information

Reel Size

Tape Width

Quantity

Tape and Reel

330 mm

24 mm

1000 pc/reel

MPXC2011DT1

MPXC2012DT1

PRESSURE SENSORS

0 to 75 mm HG

(0 TO 10 kPA

MPXC2011DT1/MPXC2012DT1

CASE 423A-03

CHIP PAK PACKAGE

PIN NUMBER

1

GND

3

2

S+

4

S-