MPXAZ4100AC6U datasheet(6/8 Pages) FREESCALE

Part #	MPXAZ4100AC6U

Description	Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal

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Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

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Freescale Semiconductor

MPXAZ4100A

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

Figure 5. SOP Footprint (Case 482)

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 8X

2.54

0.300

7.62

inch

mm

SCALE 2:1

Similar Part No. - MPXAZ4100AC6U

Manufacturer	Part #	Datasheet	Description
NXP Semiconductors	MPXAZ4100AC6U	213Kb / 13P	Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated Rev 9, 1/2009
NXP Semiconductors	MPXAZ4100AC6U	229Kb / 8P	Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated Rev 1, 05/2005

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MPXAZ4100AC6U Datasheet(PDF) 6 Page - Freescale Semiconductor, Inc

MPXAZ4100AC6U Datasheet(HTML) 6 Page - Freescale Semiconductor, Inc

Similar Part No. - MPXAZ4100AC6U

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