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SP3222EB Datasheet(PDF) 11 Page - Sipex Corporation |
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SP3222EB Datasheet(HTML) 11 Page - Sipex Corporation |
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11 / 25 page  Date:11/02/05 SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation 11 11 Date: 02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation This voltage is regulated to +5.5V. At this voltage, the internal oscillator is disabled. Si- multaneous with the transfer of the voltage to C 4, the positive side of capacitor C1 is switched to V CC and the negative side is connected to GND, allowing the charge pump cycle to begin again. The charge pump cycle will continue as long as the operational conditions for the inter- nal oscillator are present. Since both V+ and V– are separately generated from V CC; in a no–load condition V + and V– will be symmetrical. Older charge pump approaches that generate V– from V+ will show a decrease in the magnitude of V– compared to V+ due to the inherent inefficiencies in the design. The clock rate for the charge pump typically operates at 250kHz. The external capacitors can be as low as 0.1µF with a 16V breakdown voltage rating. ESD Tolerance The SP3222EB/3232EB series incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electrostatic discharges and associated transients. The improved ESD tolerance is at least ±15kV without damage nor latch-up. There are different methods of ESD testing applied: a) MIL-STD-883, Method 3015.7 b) IEC1000-4-2 Air-Discharge c) IEC1000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semiconduc- tors. This method is also specified in MIL-STD- 883,Method3015.7forESDtesting.Thepremise of this ESD test is to simulate the human body’s potential to store electrostatic energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 18. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently. The IEC-1000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC1000-4-2 is shown on Figure 19. There are two methods within IEC1000-4-2, the Air Discharge method and the Contact Discharge method. With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed. |
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