8 / 12 page
2-634
RF5163
Rev A12 061114
Evaluation Board Schematic
RF5163PCBA-WD Evaluation Board (2400MHz to 2500MHz)
C14
1.5 pF
L2*
1.5 nH
15
14
13
12
11
10
4
3
2
1
16
9
8
7
6
5
Bias
C18
330 pF
C20
1 nF
L3
10 nH
C16*
3.9 pF
C17*
1 pF
C15
10 pF
J2
RF OUT
C11*
2.2 nF
C13*
7.5 pF
U2
P_DOWN
R6
750
Ω
P_DETECT
R7
100
Ω
C19
1 nF
R8
150
Ω
C21
4.7 uF
L1
6.8 nH
Coilcraft
0603
C12
1 uF
R5
300
Ω
R2
18
Ω
R4
300
Ω
C7
2.0 pF
C8
NPP
L4
4.7 nH
C4
1 nF
C5
10 nF
R1
0
Ω
C2
4.7 uF
C6
220 pF
R3
560
Ω
C10
220 pF
C9
1 nF
VPD
C3
1 nF
FB1
TBD
P3
1
2
GND
P3-1
HDR_1X2
VPD
U1
2
3
4
5
1 RF IN
GND2
VPD
GND
RF OUT
J1
RF IN
R10
300
Ω
R9
300
Ω
C11 should be
placed 15 mils
from the PA
C1
4.7 uF
R11
18
Ω
50
Ω μstrip
50
Ω μstrip
50
Ω μstrip
50
Ω μstrip
50
Ω μstrip
50
Ω μstrip
50
Ω μstrip
Test Coupon
J3
J4
50
Ω μStrip
XX mil
TL1=45 mil (50
Ω)
from chip
VREG
P6
1
2
3
4
P6-1
VREG
P6-2
P_DETECT
GND
P6-4
P_DOWN
P1*
1
2
GND
P1-2
VCC
P5-1
VCC
P5
1
VCC
VCC
VCC
P2
1
2
GND
P2-1
HDR_1X2
VCC
P4
1
GND
2373+5163410, r2
L2 should be
placed 78 mils
(50
Ω) from
the PA
TL2=C17 should be
placed at 214 mil
(50
Ω) from the PA
TL1=C16 should
be placed at 30 mil
(50
Ω) from the PA
TL3=C13 should be placed
10 mil (50
Ω) from the PA
1. Parts with
* should be populated as closely as possible to the instructions for each part.
Notes:
2. The following parts should be placed as follows:
• For 3 dB pad before the driver, populate R9, R10 and R11. If the 3 dB pad is not needed,
populate R11 with a 0
Ω resistor.
• For 3 dB pad in between the driver and PA, populate R2, R4 and R5. If the 3 dB pad is not needed,
populate R2 with a 0
Ω resistor.