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SAA8117HL Datasheet(PDF) 2 Page - NXP Semiconductors |
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SAA8117HL Datasheet(HTML) 2 Page - NXP Semiconductors |
2 / 60 page 1999 Apr 02 2 Philips Semiconductors Product specification Digital camera USB interface IC SAA8117HL CONTENTS 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 ORDERING INFORMATION 5 QUICK REFERENCE DATA 6 BLOCK DIAGRAM 7 PINNING 8 FUNCTIONAL DESCRIPTION 8.1 Video synchronization 8.2 CIF formatter 8.3 Compression engine 8.4 Transfer buffer 8.5 SNERT interface 8.6 Sensor pulse generator 8.7 Pulse diagrams 8.8 USB video FIFO 8.9 PSIE-MMU, I2C-bus interface and USB RAM space 8.10 ATX and external ATX interface 8.11 Audio 8.12 Power management 9 CONTROL REGISTER DESCRIPTION 9.1 SNERT (UART) 9.2 I2C-bus interface 9.2.1 Commands 9.2.2 End-points 9.2.3 Control top registers 9.2.4 Video FIFO registers 9.2.5 ADIF top registers 10 LIMITING VALUES 11 THERMAL CHARACTERISTICS 12 CHARACTERISTICS 13 TIMING 14 APPLICATION INFORMATION 15 PACKAGE OUTLINE 16 SOLDERING 16.1 Introduction to soldering surface mount packages 16.2 Reflow soldering 16.3 Wave soldering 16.4 Manual soldering 16.5 Suitability of surface mount IC packages for wave and reflow soldering methods 17 DEFINITIONS 18 LIFE SUPPORT APPLICATIONS 19 PURCHASE OF PHILIPS I2C COMPONENTS |
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