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JANSF2N7494U5 Datasheet(PDF) 2 Page - International Rectifier |
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JANSF2N7494U5 Datasheet(HTML) 2 Page - International Rectifier |
2 / 8 page IRHE57Z30, JANSR2N7495U5 Pre-Irradiation 2 www.irf.com Source-Drain Diode Ratings and Characteristics Parameter Min Typ Max Units Test Conditions IS Continuous Source Current (Body Diode) — — 12* ISM Pulse Source Current (Body Diode) À —— 48 VSD Diode Forward Voltage — — 1.8 V Tj = 25°C, IS = 12A, VGS = 0V Ã trr Reverse Recovery Time — — 102 ns Tj = 25°C, IF = 12A, di/dt ≤100A/µs QRR Reverse Recovery Charge — — 196 nC VDD ≤ 25V Ã ton Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD. A Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified) Parameter Min Typ Max Units Test Conditions BVDSS Drain-to-Source Breakdown Voltage 30 — — V VGS = 0V, ID = 1.0mA ∆BVDSS/∆TJ Temperature Coefficient of Breakdown — 0.025 — V/°C Reference to 25°C, ID = 1.0mA Voltage RDS(on) Static Drain-to-Source On-State — — 0.07 Ω VGS = 12V, ID = 8.0A Resistance VGS(th) Gate Threshold Voltage 2.0 — 4.0 V VDS = VGS, ID = 1.0mA gfs Forward Transconductance 8.0 — — S ( )VDS ≥ 15V, IDS = 8.0A Ã IDSS Zero Gate Voltage Drain Current — — 10 VDS= 24V ,VGS=0V —— 25 VDS = 24V, VGS = 0V, TJ = 125°C IGSS Gate-to-Source Leakage Forward — — 100 VGS = 20V IGSS Gate-to-Source Leakage Reverse — — -100 VGS = -20V Qg Total Gate Charge — — 65 VGS =12V, ID = 12A Qgs Gate-to-Source Charge — — 20 nC VDS = 15V Qgd Gate-to-Drain (‘Miller’) Charge — — 10 td(on) Turn-On Delay Time — — 25 VDD = 15V, ID = 12A tr Rise Time — — 100 VGS =12V, RG = 7.5Ω td(off) Turn-Off Delay Time — — 35 tf Fall Time — — 30 LS + LD Total Inductance — 6.1 — Ciss Input Capacitance — 2184 — VGS = 0V, VDS = 25V Coss Output Capacitance — 940 — pF f = 1.0MHz Crss Reverse Transfer Capacitance — 35 — nA Ã nH ns µA Measured from the center of drain pad to center of source pad Note: Corresponding Spice and Saber models are available on International Rectifier web site. For footnotes refer to the last page Thermal Resistance Parameter Min Typ Max Units Test Conditions RthJC Junction-to-Case — — 5.0 RthJPCB Junction-to-PC Board — — 19 Solder to a copper clad PC Board °C/W * Current is limited by package |
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