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LT1019MH-4.5 Datasheet(PDF) 11 Page - Linear Technology |
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LT1019MH-4.5 Datasheet(HTML) 11 Page - Linear Technology |
11 / 12 page 11 LT1019 1019fd Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. PACKAGE DESCRIPTIO N8 Package 8-Lead PDIP (Narrow 0.300) (LTC DWG # 05-08-1510) S8 Package 8-Lead Plastic Small Outline (Narrow 0.150) (LTC DWG # 05-08-1610) H Package 8-Lead TO-5 Metal Can (0.200 PCD) (LTC DWG # 05-08-1320) N8 1098 0.100 (2.54) BSC 0.065 (1.651) TYP 0.045 – 0.065 (1.143 – 1.651) 0.130 ± 0.005 (3.302 ± 0.127) 0.020 (0.508) MIN 0.018 ± 0.003 (0.457 ± 0.076) 0.125 (3.175) MIN 0.009 – 0.015 (0.229 – 0.381) 0.300 – 0.325 (7.620 – 8.255) 0.325 +0.035 –0.015 +0.889 –0.381 8.255 () 12 3 4 87 6 5 0.255 ± 0.015* (6.477 ± 0.381) 0.400* (10.160) MAX *THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm) 0.050 (1.270) MAX 0.016 – 0.021** (0.406 – 0.533) 0.010 – 0.045* (0.254 – 1.143) SEATING PLANE 0.040 (1.016) MAX 0.165 – 0.185 (4.191 – 4.699) GAUGE PLANE REFERENCE PLANE 0.500 – 0.750 (12.700 – 19.050) 0.305 – 0.335 (7.747 – 8.509) 0.335 – 0.370 (8.509 – 9.398) DIA 0.200 (5.080) TYP 0.027 – 0.045 (0.686 – 1.143) 0.028 – 0.034 (0.711 – 0.864) 0.110 – 0.160 (2.794 – 4.064) INSULATING STANDOFF 45°TYP H8(TO-5) 0.200 PCD 1197 LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND 0.045" BELOW THE REFERENCE PLANE FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS 0.016 – 0.024 (0.406 – 0.610) * ** PIN 1 OBSOLETE .016 – .050 (0.406 – 1.270) .010 – .020 (0.254 – 0.508) × 45° 0°– 8° TYP .008 – .010 (0.203 – 0.254) SO8 0303 .053 – .069 (1.346 – 1.752) .014 – .019 (0.355 – 0.483) TYP .004 – .010 (0.101 – 0.254) .050 (1.270) BSC 1 2 3 4 .150 – .157 (3.810 – 3.988) NOTE 3 8 7 6 5 .189 – .197 (4.801 – 5.004) NOTE 3 .228 – .244 (5.791 – 6.197) .245 MIN .160 ±.005 RECOMMENDED SOLDER PAD LAYOUT .045 ±.005 .050 BSC .030 ±.005 TYP INCHES (MILLIMETERS) NOTE: 1. DIMENSIONS IN 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) |
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