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MAX9986AETP+ Datasheet(PDF) 10 Page - Maxim Integrated Products |
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MAX9986AETP+ Datasheet(HTML) 10 Page - Maxim Integrated Products |
10 / 12 page SiGe High-Linearity, 815MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch 10 ______________________________________________________________________________________ reference for board layout. Gerber files are available upon request at www.maxim-ic.com. Power-Supply Bypassing Proper voltage-supply bypassing is essential for high- frequency circuit stability. Bypass each VCC pin and TAP with the capacitors shown in the Typical Application Circuit; see Table 1. Place the TAP bypass capacitor to ground within 100 mils of the TAP pin. Exposed Pad RF/Thermal Considerations The exposed paddle (EP) of the MAX9986A’s 20-pin thin QFN-EP package provides a low thermal-resis- tance path to the die. It is important that the PC board on which the MAX9986A is mounted be designed to conduct heat from the EP. In addition, provide the EP with a low-inductance path to electrical ground. The EP MUST be soldered to a ground plane on the PC board, either directly or through an array of plated via holes. COMPONENT VALUE DESCRIPTION L1, L2 330nH Wire-wound high-Q inductors (0805) L3* 30nH Wire-wound high-Q inductor (0603) C1 10pF Microwave capacitor (0603) C2, C4, C7, C8, C10, C11, C12 82pF Microwave capacitors (0603) C3, C5, C6, C9, C13, C14 0.01µF Microwave capacitors (0603) C15 220pF Microwave capacitor (0402) R1 953 Ω±1% resistor (0603) R2 619 Ω±1% resistor (0603) R3 0 Ω±1% resistor (1206) T1 4:1 balun IF balun TC4-1W-7A U1 MAX9986A Maxim IC Table 1. Component List Referring to the Typical Application Circuit Pin Configuration/Functional Diagram MAX9986A 1 2 3 4 5 15 14 13 12 11 6 7 89 10 20 19 18 17 16 GND TAP RF VCC THIN QFN VCC GND GND LO2 GND LO1 *Use L3 for improved RF-to-IF and LO-to-IF isolation. See the Applications Information section regarding stability issues when using L3 inductor. |
Similar Part No. - MAX9986AETP+ |
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Similar Description - MAX9986AETP+ |
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