1999 Jun 14

12

Philips Semiconductors

Product specification

Full bridge current driven vertical deflection

booster

TDA4866

PACKAGE OUTLINE

UNIT

A

b

max.

2

de

L

j

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

4.6

4.2

1.1

0.75

0.60

0.48

0.38

24.0

23.6

20.0

19.6

10

2.54

12.2

11.8

3.4

3.1

A

max.

1

2.0

6

2.00

1.45

2.1

1.8

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

17.2

16.5

SOT131-2

92-11-17

95-03-11

0

5

10 mm

scale

Q

0.25

w

0.03

x

D

L

A

E

c

A 2

Q

d

D

Z

e

x

h

19

Eh

non-concave

1

b

j

SIL9P: plastic single in-line power package; 9 leads

SOT131-2

view B: mounting base side

B