Voidless-Hermetically-Sealed Surface

Mount Unidirectional Transient

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 3

Copyright

 2004

11-01-2004 REV A

SCOTTSD A L E DIVISION

1N6461US thru 1N6468US

FIGURE 3

T – Temperature –

8/20 µs CURRENT IMPULSE WAVEFORM

(per MIL-PRF-19500/551

FIGURE 4

DERATING CURVE

PACKAGE DIMENSIONS Inches [mm]

E-MELF-PKG (D-5B)

Note: If mounting requires adhesive separate from the solder,

an additional 0.080 inch diameter contact may be placed in the

center between the pads as an optional spot for cement as

shown in the pad layout.