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1N6464US Datasheet(PDF) 3 Page - Microsemi Corporation |
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1N6464US Datasheet(HTML) 3 Page - Microsemi Corporation |
3 / 3 page Voidless-Hermetically-Sealed Surface Mount Unidirectional Transient Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 3 Copyright 2004 11-01-2004 REV A SCOTTSD A L E DIVISION 1N6461US thru 1N6468US FIGURE 3 T – Temperature – oC 8/20 µs CURRENT IMPULSE WAVEFORM (per MIL-PRF-19500/551 FIGURE 4 DERATING CURVE PACKAGE DIMENSIONS Inches [mm] E-MELF-PKG (D-5B) Note: If mounting requires adhesive separate from the solder, an additional 0.080 inch diameter contact may be placed in the center between the pads as an optional spot for cement as shown in the pad layout. |
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