Subject to change without notice.

www.cree.com

FEATURES

XT Rectangular LED Performance

460 nm & 470 nm

XR-18™ – 18.0 mW min.

XR-21™ – 21.0 mW min.

Thin 150 µm Chip

Low Forward Voltage – 3.2 Typical at 20 mA

Single Wire Bond Structure

Class 2 ESD Rating

Sn Contact for Low-Temp. Die Attach Methods

Die Attach Options:

Flux Eutectic; Flux & Temperature (-C)

Eutectic; Temperature & Pressure (-D)

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APPLICATIONS

Mobile Appliance LCD Backlighting

Digital Camera Flash

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CxxxXR230-Sxx00-x

Cree’s XT Rectangular LEDs are the next generation of solid-state LEDs that combine highly efficient InGaN materials

chips have a geometrically enhanced Epi-down design to maximize light extraction efficiency and require only a single

wire bond connection. These vertically structured LED chips are approximately 150 microns in height and require a low

forward voltage. Cree’s XT Rectangular chips are tested for conformity to optical and electrical specifications and the

ability to withstand 1000 V ESD. Applications for XT Rectangular LEDs include next-generation mobile appliances for

use in their LCD backlights and digital camera flash where brightness, sub-miniaturization, and low power consumption

are required.

CxxxXR230-Sxx00-x Chip Diagram

Top View

Bottom View

Die Cross Section

G•SiC LED Chip

230 x 380 μm

Gold Bond Pad

105 μm Diameter

SiC Substrate

t = 150 µm

Backside

Metalization

Cathode (-)

Anode (+)