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TCM810MVB713 Datasheet(PDF) 9 Page - Microchip Technology |
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TCM810MVB713 Datasheet(HTML) 9 Page - Microchip Technology |
9 / 16 page © 2005 Microchip Technology Inc. DS21661D-page 9 TCM809/TCM810 3-Lead Plastic Small Outline Transistor (LB) (SC-70) 12° 8° 12° 8° b Mold Draft Angle Bottom 12° 8° 12° 8° a Mold Draft Angle Top 0.40 0.15 .016 .006 B Lead Width 0.25 0.08 .010 .003 c Lead Thickness 0.41 0.10 .016 .004 L Foot Length 2.25 1.80 .089 .071 D Overall Length 1.35 1.15 .053 .045 E1 Molded Package Width 2.40 1.80 .094 .071 E Overall Width .010 0.00 .0004 .000 A1 Standoff 1.00 0.80 .039 .031 A2 Molded Package Thickness 1.10 0.80 .043 .031 A Overall Height 1.30 BSC. p1 Outside lead pitch (basic) 0.65 BSC. p Pitch 3 3 Number of Pins MAX MIN MAX MIN Dimension Limits MILLIMETERS* INCHES Units shall not exceed .005" (0.127mm) per side. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions Notes: JEITA (EIAJ) Equivalent: SC70 Drawing No. C04-104 *Controlling Parameter L B E1 E p c p1 D 1 2 3 b a A A2 A1 .026 BSC. .051 BSC. |
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