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TC1301A-DPAVMFTR Datasheet(PDF) 4 Page - Microchip Technology |
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TC1301A-DPAVMFTR Datasheet(HTML) 4 Page - Microchip Technology |
4 / 28 page TC1301A/B DS21798B-page 4 © 2005 Microchip Technology Inc. Shutdown Supply Current TC1301A IIN_SHDNA —58 90 µA SHDN2 = GND, VDET = OPEN Shutdown Supply Current TC1301B IIN_SHDNB — 0.1 1 µA SHDN1 = SHDN2 = GND Power Supply Rejection Ratio PSRR — 58 — dB f ≤ 100 Hz, IOUT1 = IOUT2 = 50 mA, CIN = 0 µF Output Noise eN — 830 — nV/(Hz)½ f ≤ 1kHz, IOUT1 = IOUT2 = 50 mA, CIN = 0 µF Output Short-Circuit Current (Average) VOUT1 IOUTsc — 200 — mA RLOAD1 ≤ 1Ω VOUT2 IOUTsc — 140 — mA RLOAD2 ≤ 1Ω SHDN Input High Threshold VIH 45 —— %VIN VIN = 2.7V to 6.0V SHDN Input Low Threshold VIL —— 15 %VIN VIN = 2.7V to 6.0V Wake-Up Time (From SHDN mode), (VOUT2) tWK —5.3 20 µs VIN = 5V, IOUT1 = IOUT2 = 30 mA, See Figure 5-1 Settling Time (From SHDN mode), (VOUT2) tS —50 — µs VIN = 5V, IOUT1 = IOUT2 = 50 mA, See Figure 5-2 Thermal Shutdown Die Temperature TSD — 150 — °C VIN = 5V, IOUT1 = IOUT2 = 100 µA Thermal Shutdown Hysteresis THYS —10 — °C VIN = 5V Voltage Range VDET 1.0 1.2 — 6.0 6.0 V TA = 0°C to +70°C TA = -40°C to +125°C RESET Threshold VTH -1.4 — +1.4 % -2.8 — +2.8 %TA = -40°C to +125°C RESET Threshold Tempco ΔVTH/ΔT— 30 — ppm/°C VDET RESET Delay tRPD — 180 — µs VDET = VTH to (VTH – 100 mV), See Figure 5-3 RESET Active Time-out Period tRPU 140 300 560 ms VDET = VTH - 100 mV to VTH + 100 mV, ISINK = 1.2 mA, See Figure 5-3. RESET Output Voltage Low VOL —— 0.2 V VDET = VTHmin, ISINK = 1.2 mA, ISINK = 100 µA for VDET < 1.8V, See Figure 5-3 RESET Output Voltage High VOH 0.9 VDET —— V VDET > VTHmax, ISOURCE = 500 µA, See Figure 5-3 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = VR +1V, IOUT1 = IOUT2 = 100 µA, CIN = 4.7 µF, COUT1 = COUT2 = 1 µF, CBYPASS = 10 nF, SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Note 1: The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VR + VDROPOUT. 2: VR is defined as the higher of the two regulator nominal output voltages (VOUT1 or VOUT2). 3: TCVOUT = ((VOUTmax - VOUTmin) * 10 6)/(V OUT * ΔT). 4: Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for t = 10 ms. 6: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its value measured at a 1V differential. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown . |
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