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MCP1700T-5002ETT Datasheet(PDF) 4 Page - Microchip Technology |
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MCP1700T-5002ETT Datasheet(HTML) 4 Page - Microchip Technology |
4 / 24 page MCP1700 DS21826B-page 4 © 2007 Microchip Technology Inc. TEMPERATURE SPECIFICATIONS Power Supply Ripple Rejection Ratio PSRR — 44 — dB f = 100 Hz, COUT =1 µF, IL =50mA, VINAC =100 mV pk-pk, CIN =0µF, VR =1.2V Thermal Shutdown Protection TSD — 140 — °C VIN =VR +1, IL = 100 µA Electrical Characteristics: Unless otherwise specified, all limits are established for VIN =VR +1, ILOAD = 100 µA, COUT = 1 µF (X7R), CIN =1µF (X7R), TA = +25°C. Boldface type applies for junction temperatures, TJ (Note 1) of -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range TA -40 +125 °C Operating Temperature Range TA -40 +125 °C Storage Temperature Range TA -65 +150 °C Thermal Package Resistance Thermal Resistance, SOT-23 θJA —336 — °C/W Minimum Trace Width Single Layer Board — 230 — °C/W Typical FR4 4-layer Application Thermal Resistance, SOT-89 θJA — 52 — °C/W Typical, 1 square inch of copper Thermal Resistance, TO-92 θJA — 131.9 — °C/W EIA/JEDEC JESD51-751-7 4-Layer Board Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability. DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise specified, all limits are established for VIN =VR +1, ILOAD = 100 µA, COUT =1µF (X7R), CIN =1µF (X7R), TA = +25°C. Boldface type applies for junction temperatures, TJ (Note 6) of -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Note 1: The minimum VIN must meet two conditions: VIN ≥ 2.3V and VIN ≥ (VR + 3.0%) +VDROPOUT. 2: VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, 5.0V. The input voltage (VIN =VR + 1.0V); IOUT = 100 µA. 3: TCVOUT = (VOUT-HIGH -VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. 4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured value with a VR + 1V differential applied. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability. 7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant. |
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