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G5E2596M Datasheet(PDF) 3 Page - GTM CORPORATION |
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G5E2596M Datasheet(HTML) 3 Page - GTM CORPORATION |
3 / 6 page G5E2596M Page: 3/6 ISSUED DATE :2005/12/26 REVISED DATE :2006/03/13B All Output Voltage Version Electrical Characteristics Specifications in boldface type are for full operating temperature range. The other type are for TJ=25 : . Parameter Symbol Conditions Min Typ Max Unit Feedback bias current IFB VFB=1.3V (adjustable version only) - -10 -50/-100 nA Oscillator frequency FOSC 127/110 150 173/173 kHz Oscillator frequency of short circuit protect FSCP When current limit occurred and VFB<0.5V, TA=25 : . 5 15 25 kHz Saturation voltage VSAT I LOAD =3A No outside circuit VFB=0V force drive on - 1.4 1.6/1.7 V Max. duty cycle (ON) VFB=0V force drive on - 100 - Max. duty cycle (OFF) DC VFB=12V force drive off - 0 - % Current limit ICL Peak current No outside circuit VFB=0V force drive on 3.6 4.5 5.5/6.5 A Output=0V, No outside circuit VFB=12V force drive off - - -200 uA Output leakage current IL Output=-1V, VIN=22V - -5 - mA Quiescent current IQ VFB=12V force drive off - 5 10 mA VIL Low (Regulator ON) - - - 0.6 ON/OFF pin logic input Threshold Voltage VIH High (Regulator OFF) 2.0 - - V ON/OFF pin Logic input current IH VLOGIC=2.5V ( Regulator OFF) - - -0.01 ON/OFF pin input current IL VLOGIC=0.5V ( Regulator ON) - -0.1 -1 uA Standby quiescent current ISTBY ON/OFF pin=5V, VIN=12V - 150 200 uA JC Junction to Case - 2.5 - Thermal Resistance JA Junction to Ambient with copper area of approximately 3 in2 - 28 - : /W Unless otherwise specified, VIN=12V for 3.3V, 5V, adjustable version and VIN=18V for the 12V version. ILOAD=0.5A Function Description The TO-220 package needs a heat sink under most conditions. The size of the heat sink depends on the input voltage, the output voltage, the load current and the ambient temperature. The G5E2596M junction temperature rises above ambient temperature with a 3A load and different input and output voltages. The data for these curves was taken with the G5E2596M operating as a buck-switching regulator in an ambient temperature of 25 : (still air). These temperature rise numbers are all approximate and there are many factors that can affect these temperatures. Higher ambient temperatures require more heat sinking. For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper should be used in the board layout. (One exception to this is the output (switch) pin, which should not have large areas of copper.) Large areas of copper provide the best transfer of heat (lower thermal resistance) to the surrounding air, and moving air lowers the thermal resistance even further. Package thermal resistance and junction temperature rise numbers are all approximate, and there are many factors will affect these numbers. Some of these factors include board size, shape, thickness, position, location and even board temperature. Other factors are, trace width, total printed circuit copper area, copper thickness, single or double-sided, multi-layer board and the amount of solder on the board. The effectiveness of the PC board to dissipate heat also depends on the size, quantity and spacing of other components on the board, as well as the surrounding air is still or moving. Furthermore, some of these components such as the catch diode will add heat to the PC board and the heat can vary as the input voltage changes. For the inductor, depending on the physical size, type of core material and the DC resistance, it could either act as a heat sink taking heat away from the board, or it could add heat to the board. |
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