MT48H32M16LFCM-8LIT datasheet(1/73 Pages) MICRON

Part #	MT48H32M16LFCM-8LIT

Description	512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM

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Manufacturer	MICRON [Micron Technology]

Direct Link	http://www.micron.com

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512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM

Features

PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03

Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT48H32M16LF_1.fm - Rev. H 6/07 EN

1

Mobile SDRAM

MT48H32M16LF – 8 Meg x 16 x 4 banks

MT48H16M32LF/LG – 4 Meg x 32 x 4 banks

Features

• Endur-IC™ technology

• Fully synchronous; all signals registered on positive

edge of system clock

•VDD = 1.7–1.95V; VDDQ = 1.7–1.95V

• Internal, pipelined operation; column address can

be changed every clock cycle

• Four internal banks for concurrent operation

• Programmable burst lengths: 1, 2, 4, 8, and

continuous1

• Auto precharge, includes concurrent auto precharge

• Auto refresh and self refresh modes

• LVTTL-compatible inputs and outputs

• On-chip temperature sensor to control refresh rate

• Partial-array self refresh (PASR)

• Deep power-down (DPD)

• Selectable output drive (DS)

Table 1:

Configuration Addressing

DQ Bus

Width

Architecture

JEDEC-

Standard

Option

Reduced

Page-Size

Option2

Number of banks

4

Bank address balls

BA0, BA1

x16

Row address balls

A0–A12

–

Column address balls

A0–A9

–

x32

Row address balls

A0–A12

A0–A13

Column address balls

A0–A8

A0–A7

Table 2:

Key Timing Parameters

CL = CAS (READ) latency

Speed

Grade

Clock Rate (MHz)

Access Time

CL = 2

CL = 3

CL = 2

CL = 3

-75

104

133

9ns

6ns

-8

100

125

9ns

7ns

Notes: 1. For continuous page burst, contact factory

for availability.

2. For reduced page-size option, contact fac-

tory for availability.

3. LG is a reduced page-size option. Contact

factory for availability.

4. Only available for x32 configuration.

5. Only available for x16 configuration.

Options

Marking

•VDD/VDDQ

– 1.8V/1.8V

H

•Row size option

– Standard addressing option

LF

– Reduced page-size option

LG3, 4

• Configuration

– 32 Meg x 16 (8 Meg x 16 x 4 banks)

32M16

– 16 Meg x 32 (4 Meg x 32 x 4 banks)

16M32

• Plastic “green” packages

– 54-Ball VFBGA (10mm x 11.5mm)

CJ5

– 90-Ball VFBGA (10mm x 13mm)

CM3

• Timing – cycle time

– 7.5ns at CL = 3

-75

– 8ns at CL = 3

-8

•Power

–Standard IDD2P/IDD7None

–Low IDD2P/IDD7L

• Operating temperature range

– Commercial (0°C to +70°C)

None

– Industrial (–40°C to +85°C)

IT

•Design revision

:A

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MT48H32M16LFCM-8LIT Datasheet(PDF) 1 Page - Micron Technology

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