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CM30AD00-12H Datasheet(PDF) 4 Page - Mitsubishi Electric Semiconductor |
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CM30AD00-12H Datasheet(HTML) 4 Page - Mitsubishi Electric Semiconductor |
4 / 4 page Sep. 2000 MITSUBISHI IGBT MODULES CM30AD00-12H MEDIUM POWER SWITCHING USE FLAT BASE, INSULATED TYPE IDRM IRRM ITM IGT VGT IH Rth(j-c) Repetitive peak off-state current Repetitive peak reverse current On-state voltage Gate trigger current Gate trigger voltage Holding current Thermal resistance THYRISTOR PART dv/dt VD=800V VR=800V IT=30A, instantaneous means VD=6V, IT=1A VD=6V, IT=1A Tj=125 °C, VD=540V, exp. waveform Critical rate of rise of off-state Voltage 1 1 1.19 100 3 — 1.3 mA mA V mA V mA °C/W — — — — — 50 — — — — — — — — Symbol Parameter Test conditions Unit Typ. Limits Min. Max. 500 — — V/ µs — — Resistance Temperature coefficient Measured between N-N1 m Ω %/ °C 2.9 0.051 — — R — Symbol Parameter Test conditions Unit Typ. Limits Min. Max. RESISTOR PART — — Resistance B Constant TC = 25 °C Resistance at 25 °C, 50°C (Note.5) k Ω K 100 4000 — — RTH B Symbol Parameter Test conditions Unit Typ. Limits Min. Max. THERMISTOR PART Note. 1 IE, VEC, trr, Qrr, diE/dt represent characteristics of the anti-parallel, emitter to collector free-wheel diode. 2 Pulse width and repetition rate should be such that the device junction temp. (Tj) does not exceed Tjmax rating. 3 Junction temperature (Tj) should not increase beyond 150 °C. 4 Pulse width and repetition rate should be such as to cause negligible temperature rise. 5 B = (InR1-InR2)/(1/T1-1/T2)R1 : Resistance at T1(K) R2 : Resistance at T2(K) *1 : Typical value is measured by using Shin-etsu Silicone “G-746”. — Contact thermal resistance Case to fin, Thermal compound applied *1 (1 module) °C/W 0.035 — Rth(c-f) Symbol Parameter Test conditions Unit Typ. Limits Min. Max. COMMON RATING |
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