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ICS621M Datasheet(PDF) 5 Page - Integrated Device Technology |
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ICS621M Datasheet(HTML) 5 Page - Integrated Device Technology |
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5 / 10 page  ICS621 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 5 ICS621 REV B 030907 AC Electrical Characteristics VDD = 1.2 V ±5% , Ambient Temperature -40 to +85 °C or 0 to +70°C, unless stated otherwise VDD = 1.5 V ±5% , Ambient Temperature -40 to +85 °C or 0 to +70°C, unless stated otherwise VDD = 1.8 V ±5% , Ambient Temperature -40 to +85 °C or 0 to +70°C, unless stated otherwise Notes: 1. With rail to rail input clock 2. Between any 2 outputs with equal loading. 3. Measured with a 15 pF load. Thermal Characteristics Parameter Symbol Conditions Min. Typ. Max. Units Input Frequency 0 100 MHz Output Rise Time tOR 20% to 80%, Note 3 1.0 1.5 ns Output Fall Time tOF 80% to 20%, Note 3 1.0 1.5 ns Propagation Delay Note 1 2.2 3 5 ns Output to Output Skew Note 2 Rising edges at VDD/2 0 ±150 ps Parameter Symbol Conditions Min. Typ. Max. Units Input Frequency 0 166 MHz Output Rise Time tOR 20% to 80%, Note 3 1.0 1.5 ns Output Fall Time tOF 80% to 20%, Note 3 1.0 1.5 ns Propagation Delay Note 1 2.2 3 5 ns Output to Output Skew Note 2 Rising edges at VDD/2 0 ±150 ps Parameter Symbol Conditions Min. Typ. Max. Units Input Frequency 0 200 MHz Output Rise Time tOR 20% to 80%, Note 3 1.0 1.5 ns Output Fall Time tOF 80% to 20%, Note 3 1.0 1.5 ns Propagation Delay Note 1 2.2 3 5 ns Output to Output Skew Note 2 Rising edges at VDD/2 0 ±150 ps Parameter Symbol Conditions Min. Typ. Max. Units Thermal Resistance Junction to Ambient θ JA Still air 150 °C/W θ JA 1 m/s air flow 140 °C/W θ JA 3 m/s air flow 120 °C/W Thermal Resistance Junction to Case θ JC 40 °C/W Case Temperature 120 °C Thermal Resistance Junction to Top of Case ΨJT Still air 20 °C/W |
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