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CY7C1019D
Document #: 38-05464 Rev. *E
Page 4 of 11
Capacitance [3]
Parameter
Description
Test Conditions
Max
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz, VCC = 5.0V
6
pF
COUT
Output Capacitance
8
pF
Thermal Resistance [3]
Parameter
Description
Test Conditions
400-Mil
Wide SOJ
TSOP II
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
four-layer printed circuit board
56.29
62.22
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
38.14
21.43
°C/W
AC Test Loads and Waveforms [4]
90%
10%
3.0V
GND
90%
10%
ALL INPUT PULSES
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
Rise Time:
≤ 3 ns
Fall Time:
≤ 3 ns
30 pF*
OUTPUT
Z = 50
Ω
50
Ω
1.5V
(b)
(a)
5V
OUTPUT
5 pF
(c)
R1 480
Ω
R2
255
Ω
High-Z characteristics:
INCLUDING
JIG AND
SCOPE
Notes
3. Tested initially and after any design or process changes that may affect these parameters.
4. AC characteristics (except High-Z) are tested using the load conditions shown in Figure (a). High-Z characteristics are tested for all speeds using the test load
shown in Figure (c).
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