512K (32K x 16) Static RAM
CY7C1020CV33
Cypress Semiconductor Corporation
•
198 Champion Court
•
San Jose
, CA 95134-1709
•
408-943-2600
Document #: 38-05133 Rev. *E
Revised August 3, 2006
Features
• Pin- and function-compatible with CY7C1020V33
• Temperature Ranges
— Commercial: 0°C to 70°C
— Industrial: –40°C to 85°C
— Automotive: –40°C to 125°C
•High speed
—tAA = 10 ns
• CMOS for optimum speed/power
• Low active power
— 325 mW (max.)
• Automatic power-down when deselected
• Independent control of upper and lower bits
• Available in Pb-free and non Pb-free 44-pin TSOP II
package
Functional Description
The CY7C1020CV33 is a high-performance CMOS static
RAM organized as 32,768 words by 16 bits. This device has
an automatic power-down feature that significantly reduces
power consumption when deselected.
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is
written into the location specified on the address pins (A0
through A14). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O9 through I/O16) is written into the location
specified on the address pins (A0 through A14).
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O1 to I/O8. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O9 to I/O16. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
The input/output pins (I/O1 through I/O16) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY7C1020CV33 is available in standard 44-pin TSOP
Type II package.
WE
Logic Block Diagram
1
2
3
4
5
6
7
8
9
10
11
14
31
32
36
35
34
33
37
40
39
38
Top View
TSOP II
12
13
41
44
43
42
16
15
29
30
VCC
A14
A13
A12
NC
NC
A3
OE
VSS
A5
I/O16
A2
CE
I/O3
I/O1
I/O2
BHE
NC
A1
A0
18
17
20
19
I/O4
27
28
25
26
22
21
23
24
NC
VSS
I/O7
I/O5
I/O6
I/O8
A6
A7
BLE
VCC
I/O15
I/O14
I/O13
I/O12
I/O11
I/O10
I/O9
A8
A9
A10
A11
32K × 16
RAM Array
I/O1–I/O8
A7
A6
A5
A4
A3
A0
COLUMN DECODER
DATA IN DRIVERS
OE
A2
A1
I/O9–I/O16
CE
WE
BLE
BHE
A4
Note:
1. NC pins are not connected on the die
PinConfiguration[1]
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