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CY7C1062AV33-12BGC Datasheet(PDF) 4 Page - Cypress Semiconductor

Part # CY7C1062AV33-12BGC
Description  512K x 32 Static RAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1062AV33-12BGC Datasheet(HTML) 4 Page - Cypress Semiconductor

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CY7C1062AV33
Document #: 38-05137 Rev. *F
Page 4 of 9
AC Switching Characteristics Over the Operating Range[6]
Parameter
Description
–8
–10
–12
Unit
Min.
Max.
Min.
Max.
Min.
Max.
Read Cycle
tpower
VCC (typical) to the first access
[7]
11
1
ms
tRC
Read Cycle Time
8
10
12
ns
tAA
Address to Data Valid
8
10
12
ns
tOHA
Data Hold from Address Change
3
3
3
ns
tACE
CE1, CE2, or CE3 LOW to Data Valid
8
10
12
ns
tDOE
OE LOW to Data Valid
5
5
6
ns
tLZOE
OE LOW to Low-Z[8]
11
1
ns
tHZOE
OE HIGH to High-Z[8]
55
6
ns
tLZCE
CE1, CE2, or CE3 LOW to Low-Z
[8]
33
3
ns
tHZCE
CE1, CE2, or CE3 HIGH to High-Z
[8]
55
6
ns
tPU
CE1, CE2, or CE3 LOW to Power-up
[9]
00
0
ns
tPD
CE1, CE2, or CE3 HIGH to Power-down
[9]
810
12
ns
tDBE
Byte Enable to Data Valid
5
5
6
ns
tLZBE
Byte Enable to Low-Z[8]
11
1
ns
tHZBE
Byte Disable to High-Z[8]
55
6
ns
Write Cycle[10, 11]
tWC
Write Cycle Time
8
10
12
ns
tSCE
CE1, CE2, or CE3 LOW to Write End
6
7
8
ns
tAW
Address Set-up to Write End
6
7
8
ns
tHA
Address Hold from Write End
0
0
0
ns
tSA
Address Set-up to Write Start
0
0
0
ns
tPWE
WE Pulse Width
6
7
8
ns
tSD
Data Set-up to Write End
5
5.5
6
ns
tHD
Data Hold from Write End
0
0
0
ns
tLZWE
WE HIGH to Low-Z[8]
33
3
ns
tHZWE
WE LOW to High-Z[8]
55
6
ns
tBW
Byte Enable to End of Write
6
7
8
ns
Data Retention Waveform
Notes:
6. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
IOL/IOH and transmission line loads. Test conditions for the read cycle use output loading as shown in (a) of AC Test Loads, unless specified otherwise.
7. This part has a voltage regulator that steps down the voltage from 3V to 2V internally. tpower time has to be provided initially before a read/write operation is started.
8. tHZOE, tHZCE, tHZWE, tHZBE, and tLZOE, tLZCE, tLZWE, and tLZBE are specified with a load capacitance of 5 pF as in (b) of AC Test Loads. Transition is measured
± 200 mV from steady-state voltage.
9. These parameters are guaranteed by design and are not tested.
10. The internal write time of the memory is defined by the overlap of CE1 LOW, CE2 HIGH, CE3 LOW, and WE LOW. The chip enables must be active and WE
must be LOW to initiate a write, and the transition of any of these signals can terminate the write. The input data set-up and hold timing should be referenced to
the leading edge of the signal that terminates the write.
11. The minimum write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
3.0V
3.0V
tCDR
VDR > 2V
DATA RETENTION MODE
tR
CE
VCC
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