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IDTIDT71P79104267BQ Datasheet(PDF) 9 Page - Integrated Device Technology

Part # IDTIDT71P79104267BQ
Description  18Mb Pipelined DDR?줚I SIO SRAM Burst of 2
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

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IDT71P79204 (2Mx8-Bit), 71P79104 (2Mx9-Bit), 71P79804 (1Mx18-Bit) 71P79604 (512Kx36-Bit)
18 Mb DDR II SIO SRAM Burst of 2
Commercial and Industrial Temperature Ranges
Absolute Maximum Ratings(1)(2)
Capacitance (TA = +25°C, f = 1.0MHz)(1)
Notes:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS
may cause permanent damage to the device. This is a stress rating only and
functionaloperationofthedeviceattheseoranyotherconditionsabovethose
indicatedintheoperationalsectionsofthisspecificationisnotimplied.Exposure
to absolute maximum rating conditions for extended periods may affect
reliability.
2. VDDQ must not exceed VDD during normal operation.
Note:
1. Tested at characterization and retested after any design or process change that
may affect these parameters.
Symbol
Parameter
Conditions
Max.
Unit
CIN
Input Capacitance
VDD = 1.8V
VDDQ = 1.5V
5pF
CCLK
Clock Input Capacitance
6
pF
CO
Output Capacitance
7
pF
6432 tbl 06
Symbol
Rating
Value
Unit
VTERM
Supply Voltage on VDD with
Respect to GND
–0.5 to +2.9
V
VTERM
Supply Voltage on VDDQ with
Respect to GND
–0.5 to VDD+0.3
V
VTERM
Voltage on Input terminals with
respect to GND
–0.5 to VDD +0.3
V
VTERM
Voltage on output and I/O
terminals with respect to GND
–0.5 to VDDQ +0.3
TBIAS
Temperature Under Bias
–55 to +125
°C
TSTG
Storage Temperature
–65 to +150
°C
IOUT
Continuous Current into Outputs
+ 20
mA
6432 tbl 05
Recommended DC Operating
Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
VDD
Power Supply Voltage
1.7
1.8
1.9
V
VDDQ
I/O Supply Voltage
1.4
1.5
1.9
V
VSS
Ground
0
0
0
V
VREF
Input Reference Voltage
-
VDDQ/2
-V
TA
Ambient
Temperature(1)
Commercial
0 to +70
o
c
Industrial
-40 to +85
o
c
6432 tbl 04
Notes:
1) All byte write (
BWx) and nibble write (NWx) signals are sampled on
the rising edge of K and again on
K. The data that is present on the data bus\
in the designated byte/nibble will be latched into the input if the corresponding
BWx or NWx is held low. The rising edge of K will sample the first byte/nibble
of the two word burst and the rising edge of
K will sample the second byte
nibble of the two word burst.
2) The availability of the
BWx or NWx on designated devices is described in the
pin description table.
3) The DDRII SIO Burst of two SRAM has data forwarding. A read request that
is initiated on cycle following a write request to the same address will produce
the newly written data in response to the read request.
Signal
BW0
BW1
BW2
BW3
NW0
NW1
Write Byte 0
L
XXXX
X
Write Byte 1
X
L
XXX
X
Write Byte 2
X
X
L
X
X
X
Write Byte 3
X
X
X
L
X
X
Write Nibble 0
X
X
X
X
L
X
Write Nibble 1
X
XXXX
L
6432 tbl 09
Write Descriptions(1,2)
Note:
1. During production testing, the case temperature equals the ambient
temperature.


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